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COMPUTATIONAL FLUID DYNAMICS (CFD) ANALYSIS OF TURNKEY CABLE ASSEMBLY

Computational fluid dynamics (CFD) analysis for a world leader in the design and manufacture of complete, turnkey cable assemblies for OEMs of ultrasound, surgical, and high speed data operations. A conjugate (convective - conductive thermal fluids analysis was performed on a tightly integrated circuit board enclosed within a plastic case. Various cooling scenarios were investigated (forced cooling via a small embedded fan and natural convection) and chip junction temperatures predicted.

Modeling notes: Based on these CFD analyses, the circuit board chip density and power density (watt loading per chip) was optimized for long term thermal reliability.